• For rework and repair of defective BGA components
• The temperature is monitored by digital control electronics
• Monitoring software determines temperature profiles and controls process
• A two-zone infrared bottom heater precisely controls pre heat
• High resolution 2 Mpix CMOS USB camera enables accurate positioning
• Interfaces with a standard PC via a USB 2.0 port
• Patented nozzles provides a finely metered heat supply to the components
• A temperature sensor prevents thermal overload of the component

As on-board components become increasingly complex, Weller® continues to lead the field with innovative, user-friendly repair and assembly tools that enable users to successfully take on increasingly demanding rework challenges.

The WQB4000SOPS (Split Optic Positioning System) is the third generation of the Weller BGA/SMT repair system. It is engineered to meet the exceptional demands placed on modern rework tools and is designed to deliver real value for your investment.

It is a comprehensive, user-friendly system for the removal and soldering of BGA components, without the risk of thermal damage to the component or circuit board.